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MEMS sensor and PCB thermal performance

Ensuring MEMS Sensor and PCB reliability in changing environments

MEMS sensor and PCB thermal performance

A client from the electronics sector needed to evaluate the performance of their MEMS sensor, a delicate device with micron-scale mechanical systems, under rapidly changing environmental conditions. Given the sensor's sensitivity to temperature and deformation, they sought our expertise to simulate its behavior under frequent heating and cooling cycles.

We conducted a transient thermal analysis to capture the effects of these rapid temperature changes over time. This approach allowed us to assess how heat flows through both the sensor package and its sensing cores, helping us identify potential overheating risks and ensure optimal thermal management.

The results provided our client with valuable insights into their device’s thermal performance, enabling them to enhance durability and maintain accuracy even in challenging environments.

For sensitive devices like MEMS sensors, transient analysis is an essential tool for ensuring reliability and long-term functionality. Let us help you future-proof your designs.

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